The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor).
Today’s semi-autonomous cars use a wide range of sensors (i.e. cameras, radar, and LiDAR) to assist the driver. However, the driver must still handle the actual driving. In order to reach the conditional autonomy offered at level 3, it was necessary to bundle sensor-derived data into a central interface unit that can combine and interpret the data, and react without human intervention.
The zFAS control unit, manufactured by Aptiv (Delphi) in Hungary, is the brain of the Audi A8’s advanced driver assistance system (ADAS) platform. zFas combines multiple computing tasks on a powerful main board equipped with multiple microprocessors and a microcontroller. The included Nvidia Tegra K1 sensor is dedicated to processing data from the cameras to create a 360-degree surround view of the vehicle. Meanwhile, the Mobileye EyeQ3 processes the more time-critical data from the stereo front-camera and driver-monitoring camera. The Intel (Altera) Cyclone V chip, with an integrated ARM processor, is used for most of the sensor data fusion, and the Infineon Tricore chip is responsible for steering and braking decisions. Lastly, AT&S supplies the electronic board, which uses semi-Flex technology.
Our report, which is based on a complete teardown analysis of the Audi A8 zFAS control unit, provides the bill-of-materials (BOM) and manufacturing cost of the control unit. The report also includes a physical analysis of the main ICs (NVIDIA, Intel, and Infineon), along with a complete cost analysis and an estimated sales price.
- Table of Contents -
- Executive Summary
- Main Chipset
- Block Diagram
- Views and Dimensions of the System
- System Opening
- Electronic Board
- Global View
- High-Definition Photos
- Markings and Identification of Components
- NVIDIA Tegra K1 – Opening
- Substrate Cross-Section and Cost Estimate
- Cost Estimate – Processors
- BOM Cost – Electronic Board
- BOM Cost – Housing
- Material Cost Breakdown
- Accessing the Added-Value (AV) Cost
- Manufacturing Cost Breakdown
Estimated Price Analysis