Yole/SystemPlus/KnowMade
SystemPlus Consulting º¸°í¼
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The Huawei Mate 20 Pro¡¯s 3D Depth-Sensing System(È¿þÀÌ ¸ÞÀÌÆ® 20ÇÁ·ÎÀÇ 3D µª½º-¼¾½Ì ½Ã½ºÅÛ)
¢æ3,990
2019-02
Wolfspeed CAS325M12HM2 All-SiC 1200V Power Module
¢æ3,990
2019-02
Ainstein K-77 Long Range Radar featuring Calterah CAL77A2T4R FOWLP Transceiver(Calterah CAL77A2T4R FOWLP Æ®·£½Ã¹ö ÀåÂøÇÑ Ainstein K-77 Àå°Å¸® ·¹ÀÌ´õ)
¢æ3,990
2019-01
Honeywell HG4930CA51 6-Axis MEMS Inertial Sensor(Çã´ÏÀ£ HG4930CA51 6-Axis MEMS °ü¼º ¼¾¼)
¢æ3,990
2019-01
Honeywell HG1120CA50 9-axis MEMS Inertial Sensor(Çã´ÏÀ£ HG1120CA50 9-axis MEMS °ü¼º ¼¾¼)
¢æ3,990
2019-01
Advanced Packaging Technology in the Apple Watch Series 4¡¯s System-in-Package(¾ÖÇÿöÄ¡ ½Ã¸®Áî 4 SiPÀÇ Ã·´Ü ÆÐŰ¡ ±â¼ú)
¢æ3,990
2019-01
Mobile Camera Module Comparison 2019 (¸ð¹ÙÀÏ Ä«¸Þ¶ó ¸ðµâ ºñ±³ 2019)
¢æ6,490
2019-01
Mantis Vision¡¯s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Edition(»þ¿À¹Ì Mi8 ÀͽºÇ÷η¯¿ë ¸ÇƼ½º ºñÀüÀÇ 3D ½Éµµ °¨Áö ½Ã½ºÅÛ)
¢æ3,990
2018-12
Xiaomi Mi 8 Explorer Teardown and Identification of Key Components(»þ¿À¹Ì Mi8 ÀͽºÇ÷η¯ Å×¾î´Ù¿î ¹× ÁÖ¿ä ±¸¼º¿ä¼Ò ½Äº°)
¢æ1,990
2018-12
Wafer to Wafer Permanent Bonding Comparison 2018(W2W ¿µ±¸ º»µù ºñ±³ 2018)
¢æ4,990
2018-12
Leading-edge 3D NAND Memory Comparison 2018 (¸®µù ¿¡Áö 3D NAND ¸Þ¸ð¸® ºñ±³ 2018)
¢æ4,990
2018-12
Qorvo QPF4006 39GHz GaN MMIC Front End Module (ÄÚº¸ÀÇ QPF4006 39GHz GaN MMIC ÇÁ·ÐÆ® ¿£µå ¸ðµâ)
¢æ3,990
2018-11
Automotive Radar Comparison 2018(ÀÚµ¿Â÷¿ë ·¹ÀÌ´õ ºñ±³ 2018)
¢æ4,990
2018-11
Samsung Exynos 9110 with ePLP: First Generation of Samsung¡¯s Fan-Out Panel Level Packaging (FO-PLP)(ePLP Æ÷ÇÔÇÑ »ï¼º ¿¢½Ã³ë½º 9110 : »ï¼º FO-PLP 1¼¼´ë)
¢æ3,990
2018-11
Orbbec¡¯s Front 3D Depth Sensing System in the Oppo Find X (¿À¸£º¤ÀÇ ¿ÀÆ÷ ÆÄÀεåX Àü¸é 3D µª½º °¨Áö ½Ã½ºÅÛ)
¢æ3,990
2018-11
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